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DE-FBM
An intelligent failure analysis system for memory chips

Overview

Fail Bitmap Analysis System serves as a pivotal diagnostic tool in semiconductor memory chip manufacturing and testing. Within the nanoscale chip environment, each failing bit represents a significant drain on profitability. As memory chip architectures and processes grow in complexity, conventional analytical approaches prove inefficient, significantly impeding efforts to improve product yield.

DE-FBM represents a new era of intelligent failure analysis, engineered to uncover the root cause of every single bit fail and drive yield optimization to its peak. More than just a tool, DE-FBM serves as your dedicated chip diagnostic expert and yield engineering partner. The system is designed to provide a deep, actionable understanding from massive failure data, allowing engineers to accurately target the root cause and make decisions in nanoscale problem-solving.

Features

Rapid memory test data parsing, visualization, classification, and statistics
DE-FBM leverages an optimized data parsing script that delivers exceptional performance through efficient stream processing and parallel algorithms. This breakthrough achieves outstanding throughput with low latency, eliminating bottlenecks in massive-scale data processing and transforming real-time data insights into a powerful engine for business growth.
Support for BitMap Viewer at any level with analysis of nearly 30 fail modes
DE-FBM supports Bitmap visualization across all levels (Wafer, Die, Block, Bank, Instance, Bit) and covers nearly 30 fail modes (including SBL, DWL, DCROSS, MWL).
Flexible BitMap comparison
DE-FBM enables flexible BitMap comparison across different wafers, test methods, test conditions at different levels, revealing core differences in fail modes.
Enable YMS data correlation and support Defect Overlay Analysis
By performing correlation analysis with YMS (WAT/CP/MET) data and conducting Defect Overlay analysis with various inspection layers, the system quantifies the key ratio of each Fail Event to different defect types, helping users identify the true root cause.
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